name 5-[[2-hydroxy-5-methyl-3-[(2,4,5-trihydroxyphenyl)methyl]phenyl]methyl]benzene-1,2,4-triol
[CAS 3046390-84-2]

Identification

• Classification: Chemical reagent >> Organic reagent >> Phenols
• Name: 5-[[2-hydroxy-5-methyl-3-[(2,4,5-trihydroxyphenyl)methyl]phenyl]methyl]benzene-1,2,4-triol
• Synonyms: SCHEMBL27420293
• Molecular Formula: C21H20O7
• Molecular Weight: 384.38
• CAS Registry Number: 3046390-84-2
• SMILES: CC1=CC(=C(C(=C1)CC2=CC(=C(C=C2O)O)O)O)CC3=CC(=C(C=C3O)O)O

Discovery and Applications

5-[[2-Hydroxy-5-methyl-3-[(2,4,5-trihydroxyphenyl)methyl]phenyl]methyl]benzene-1,2,4-triol is a polyphenolic aromatic compound containing multiple hydroxyl groups and benzyl-linked phenolic structures. The compound belongs to the class of phenol derivatives and was disclosed as a phenolic compound in research related to photosensitive resin compositions, cured materials, and display device technologies. Its structure contains three aromatic rings connected through methylene bridges, with several hydroxyl groups distributed across the aromatic framework.

The compound was reported in the patent literature as a component of photosensitive resin compositions used for forming cured products and electronic display-related materials. The patent publication WO-2024135186-A1 describes photosensitive resin compositions, cured products, organic electroluminescent display devices, and display devices containing phenolic compounds of this type. The disclosed phenolic compounds were investigated as components capable of contributing to the performance of photosensitive materials used in advanced electronic applications.

The molecular structure of this compound is based on a highly substituted phenolic framework. It contains a central aromatic ring substituted with hydroxyl groups, a methyl group, and a benzyl-linked trihydroxyphenyl group. The two phenyl units are connected through methylene (-CH₂-) bridges, producing a rigid aromatic structure with multiple phenolic functionalities.

The hydroxyl groups are the defining structural feature of the molecule. Each phenolic hydroxyl group contains an oxygen atom capable of hydrogen bonding and contributes polarity to the compound. The high number of hydroxyl groups increases the ability of the molecule to interact with other components in resin systems through hydrogen bonding and intermolecular interactions.

Phenolic compounds with multiple hydroxyl groups have long been studied in polymer chemistry because their functional groups can influence resin properties. The hydroxyl groups can participate in reactions with other resin components or affect the physical behavior of cured materials, including adhesion, thermal stability, mechanical properties, and compatibility with other formulation ingredients.

The compound described in WO-2024135186-A1 was investigated for use in photosensitive resin compositions. Photosensitive resins are materials that undergo chemical changes when exposed to light, allowing selective pattern formation through photolithographic processes. Such materials are widely used in electronic manufacturing, including applications associated with display devices and microfabrication technologies.

In photosensitive resin systems, phenolic compounds can function as molecular components that influence solubility changes, film properties, and interactions with photoactive materials. The multiple phenolic hydroxyl groups in this compound provide sites for hydrogen bonding and contribute to the behavior of the resin composition before and after curing.

The aromatic structure of the compound also contributes to its material properties. The multiple benzene rings provide rigidity and thermal resistance, while the methylene linkages provide a degree of structural flexibility. This combination of aromatic stability and functional group density is useful in designing organic materials with controlled physical properties.

The compound is particularly relevant to organic electroluminescent display technology because high-performance display materials require carefully controlled characteristics, including heat resistance, film-forming ability, and dimensional stability. Phenolic compounds with suitable structures can be incorporated into resin formulations used to prepare protective layers, insulating layers, patternable materials, or other functional components.

The methyl substituent on the aromatic framework modifies the molecular structure by introducing additional hydrophobic character and affecting the steric environment around neighboring hydroxyl groups. Together with the hydroxyl groups and aromatic rings, this substitution pattern determines the compound's intermolecular interactions and material compatibility.

Unlike simple phenol derivatives, this compound contains a multi-ring architecture with six phenolic hydroxyl groups. Such structures are commonly investigated as high-functionality molecular components because multiple reactive or interactive sites can influence polymer network formation and material performance.

The discovery and application of this compound are therefore associated with the development of advanced phenolic materials for electronic applications rather than with traditional small-molecule chemical uses. Its importance comes from the relationship between its highly functionalized aromatic structure and the requirements of photosensitive resin technologies.

Overall, 5-[[2-hydroxy-5-methyl-3-[(2,4,5-trihydroxyphenyl)methyl]phenyl]methyl]benzene-1,2,4-triol is a highly hydroxylated phenolic compound disclosed for use in photosensitive resin compositions and related electronic display materials. Its multiple phenolic groups, aromatic framework, and multifunctional structure make it a specialized material component for research and development in advanced polymer and display technologies.


References

2024. Photosensitive resin composition, cured product, organic el display device, display device, and phenol compound, URL: WO-2024135186-A1